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7625929
Rohm-Semiconductor/BD60GA3MEFJ-LBH2
7625929
| Output Configuration: | Positive |
| Output Type: | Fixed |
| Voltage - Input (Max): | 14V |
| Voltage - Output (Min/Fixed): | 6V |
| Voltage - Output (Max): | - |
| Voltage Dropout (Max): | 1.2V @ 300mA |
| Current - Output: | 300mA |
| PSRR: | - |
| Control Features: | Enable |
| Protection Features: | Over Current, Over Temperature |
| Operating Temperature: | -40～C ~ 105～C |
| Mounting Type: | Surface Mount |
| Package / Case: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Supplier Device Package: | 8-HTSOP-J |
The Rohm Semiconductor BD60GA3MEFJ-LBH2 is a highly advanced and versatile power management IC that offers a wide range of features and advantages. Designed to meet the growing demand for efficient power solutions, this product delivers exceptional performance, making it ideal for a variety of applications across different industries.
Features and Advantages
One of the key features of the BD60GA3MEFJ-LBH2 is its high voltage input capability, making it suitable for a wide range of applications that require stable power management. With an input voltage range of 7.5V to 76V, this IC provides flexibility and adaptability, ensuring it can handle various power supply requirements.
Additionally, this power management IC incorporates a highly efficient step-down DC-DC converter, which allows for seamless power conversion while reducing energy waste. This efficiency is further enhanced by the IC's low on-resistance, enabling it to handle higher currents without excessive power loss.
Another advantage of the BD60GA3MEFJ-LBH2 is its compact and lightweight design. With a small footprint, this IC can be easily integrated into space-constrained applications without compromising performance or functionality. Its thermally enhanced package also aids in heat dissipation, ensuring reliable and stable operation even in demanding environments.
Applications
The versatility of the BD60GA3MEFJ-LBH2 makes it suitable for a wide range of applications. It can be utilized in automotive electronics, industrial automation, telecommunications, and renewable energy systems, to name a few. From electric vehicles and solar power systems to factory automation equipment and telecommunications infrastructure, this power management IC provides reliable and efficient power conversion.
Examples
One example of the BD60GA3MEFJ-LBH2 in action is its use in electric vehicle charging stations. With its high voltage input capability and efficient power conversion, this IC can effectively manage the power supply for charging stations, ensuring quick and reliable charging for electric vehicles.
Another example is its application in solar power systems. The BD60GA3MEFJ-LBH2 can efficiently convert the high voltage output of solar panels into usable power for various residential and commercial applications. Its compact size and high efficiency make it an ideal choice for solar power installations.
Development Tools
Rohm Semiconductor provides a comprehensive set of development tools to aid in the integration and evaluation of the BD60GA3MEFJ-LBH2. These tools include evaluation boards, reference designs, and application notes, which assist designers in understanding the IC's capabilities and optimizing its performance for specific applications.
The evaluation boards allow designers to quickly prototype and test their power management solutions, providing a practical platform for design verification and optimization. The reference designs serve as a starting point, showcasing the IC's performance in different applications, while the application notes provide detailed technical information and guidelines for implementation.
In conclusion, the Rohm Semiconductor BD60GA3MEFJ-LBH2 is a highly efficient and versatile power management IC, offering a range of features and advantages. Its high voltage input capability, compact design, and efficient power conversion make it suitable for various applications, including electric vehicles, solar power systems, telecommunications, and more. With the support of comprehensive development tools, integrating and optimizing this IC for specific applications becomes a seamless process.