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Xilinx XCZU11EG-2FFVC1760E

Manufacturer Part Number : XCZU11EG-2FFVC1760E
Manufacturer : Xilinx
Description : IC FPGA 512 I/O 1760FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU11EG-2FFVC1760E.PDF XCZU11EG-2FFVC1760E PDF
EDA / CAD Models : XCZU11EG-2FFVC1760E by SnapEDA
Quantity:
1 81 7340425 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU11EG-2FFVC1760E 7340425
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Overview of XCZU11EG-2FFVC1760E

Xilinx Inc. has introduced the XCZU11EG-2FFVC1760E, a powerful FPGA (Field Programmable Gate Array). This high-end device is specifically designed to meet the needs of modern digital applications. Offering robust features and superior technical performance, it highlights Xilinx's commitment to delivering industry-leading solutions.

Key Features of XCZU11EG-2FFVC1760E

  • UltraScale+ Architecture: A cutting-edge technology that provides high-performance, high-capacity programmability for a vast range of applications.
  • High I/O Pin Count: This feature makes it suitable for applications demanding ample connectivity.
  • Dual-core ARM Cortex-A53 Application Processing Unit: This robust processing unit ensures high computational power for tackling complex digital tasks.
  • High-speed transceivers: XCZU11EG-2FFVC1760E consists of high-speed transceivers that promote faster data transmission.

Technical Specifications of XCZU11EG-2FFVC1760E

The XCZU11EG-2FFVC1760E contains a host of technical specifications that distinguish it from other FPGAs. This includes an operating supply voltage of 0.93 V, a maximum clock frequency of 266 MHz, and an operating temperature range of 0 to 100 degrees Celsius. The FPGA is surface-mounted and comes in a Flip-Chip BGA-1760 package. With its formidable specifications, it stands out as a prime choice for professionals seeking performance.

Applications of XCZU11EG-2FFVC1760E

The XCZU11EG-2FFVC1760E is engineered to serve a myriad of applications. It is ideally suited for advanced driver assistance systems (ADAS) and high-performance computing applications that require significant computational power and speed. Additionally, it can also be deployed in embedded vision systems, industrial automation systems, and aerospace and defense systems, showcasing its unique flexibility and multi-purpose capabilities.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU11EG-2FFVC1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU11EG-2FFVC1760E

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Product Details

Overview of XCZU11EG-2FFVC1760E

Xilinx Inc. has introduced the XCZU11EG-2FFVC1760E, a powerful FPGA (Field Programmable Gate Array). This high-end device is specifically designed to meet the needs of modern digital applications. Offering robust features and superior technical performance, it highlights Xilinx's commitment to delivering industry-leading solutions.

Key Features of XCZU11EG-2FFVC1760E

  • UltraScale+ Architecture: A cutting-edge technology that provides high-performance, high-capacity programmability for a vast range of applications.
  • High I/O Pin Count: This feature makes it suitable for applications demanding ample connectivity.
  • Dual-core ARM Cortex-A53 Application Processing Unit: This robust processing unit ensures high computational power for tackling complex digital tasks.
  • High-speed transceivers: XCZU11EG-2FFVC1760E consists of high-speed transceivers that promote faster data transmission.

Technical Specifications of XCZU11EG-2FFVC1760E

The XCZU11EG-2FFVC1760E contains a host of technical specifications that distinguish it from other FPGAs. This includes an operating supply voltage of 0.93 V, a maximum clock frequency of 266 MHz, and an operating temperature range of 0 to 100 degrees Celsius. The FPGA is surface-mounted and comes in a Flip-Chip BGA-1760 package. With its formidable specifications, it stands out as a prime choice for professionals seeking performance.

Applications of XCZU11EG-2FFVC1760E

The XCZU11EG-2FFVC1760E is engineered to serve a myriad of applications. It is ideally suited for advanced driver assistance systems (ADAS) and high-performance computing applications that require significant computational power and speed. Additionally, it can also be deployed in embedded vision systems, industrial automation systems, and aerospace and defense systems, showcasing its unique flexibility and multi-purpose capabilities.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU11EG-2FFVC1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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