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Xilinx XCZU17EG-3FFVB1517E

Manufacturer Part Number : XCZU17EG-3FFVB1517E
Manufacturer : Xilinx
Description : IC FPGA 644 I/O 1517FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU17EG-3FFVB1517E.PDF XCZU17EG-3FFVB1517E PDF
EDA / CAD Models : XCZU17EG-3FFVB1517E by SnapEDA
Quantity:
1 81 7340462 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU17EG-3FFVB1517E 7340462
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1517-BBGA, FCBGA
Supplier Device Package:1517-FCBGA (40x40)

XCZU17EG-3FFVB1517E: A Powerful FPGA Solution from Xilinx Inc.

The XCZU17EG-3FFVB1517E is an advanced Field Programmable Gate Array (FPGA) developed by Xilinx Inc., a leading manufacturer in the semiconductor industry. This FPGA offers a range of key features and technical specifications that make it an ideal choice for various applications.

Key Features:

  • High Performance: The XCZU17EG-3FFVB1517E is designed to deliver exceptional performance, offering a large number of programmable logic cells and high-speed transceivers. This allows for efficient processing of complex algorithms and data-intensive tasks.
  • Versatility: This FPGA offers a versatile architecture that supports a wide range of applications. It provides a combination of programmable logic, digital signal processing (DSP), and embedded processing capabilities, making it suitable for diverse use cases.
  • Flexible Connectivity: With a rich set of high-speed transceivers, the XCZU17EG-3FFVB1517E enables seamless connectivity with various external devices and interfaces. It supports industry-standard protocols, such as PCIe, Ethernet, and USB, facilitating easy integration into existing systems.
  • High Memory Capacity: This FPGA features a large on-chip memory, allowing for efficient storage and retrieval of data. It also supports external memory interfaces to accommodate additional storage requirements.
  • Advanced Power Management: The XCZU17EG-3FFVB1517E incorporates advanced power management techniques, optimizing power consumption while maintaining high performance. This contributes to energy-efficient operation and reduced overall system costs.

Technical Specifications:

  • FPGA Family: XCZU17EG
  • Device Grade: -3
  • Packages: FFVB1517E
  • Logic Cells: Up to 1,143,000
  • DSP Slices: Up to 4,272
  • Internal Memory: Up to 82.8 Mb
  • Transceivers: Up to 32.75 Gbps
  • Operating Voltage: 0.95V
  • Operating Temperature: -40°C to 100°C
  • Package Type: Flip-Chip Fine-Pitch BGA (FFVB)

Application:

The XCZU17EG-3FFVB1517E FPGA finds applications in various fields, including but not limited to:

  • Wireless Communications: With its high-performance processing capabilities and flexible connectivity options, this FPGA is suitable for wireless communication systems, enabling efficient signal processing, modulation, and demodulation.
  • Image and Video Processing: The XCZU17EG-3FFVB1517E is well-suited for image and video processing applications, offering the processing power and memory capacity required for tasks such as image recognition, video encoding, and decoding.
  • High-Performance Computing: This FPGA can be leveraged in high-performance computing environments, delivering accelerated processing for applications like data

    As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU17EG-3FFVB1517E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU17EG-3FFVB1517E

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1517-BBGA, FCBGA
Supplier Device Package:1517-FCBGA (40x40)

Product Details

XCZU17EG-3FFVB1517E: A Powerful FPGA Solution from Xilinx Inc.

The XCZU17EG-3FFVB1517E is an advanced Field Programmable Gate Array (FPGA) developed by Xilinx Inc., a leading manufacturer in the semiconductor industry. This FPGA offers a range of key features and technical specifications that make it an ideal choice for various applications.

Key Features:

  • High Performance: The XCZU17EG-3FFVB1517E is designed to deliver exceptional performance, offering a large number of programmable logic cells and high-speed transceivers. This allows for efficient processing of complex algorithms and data-intensive tasks.
  • Versatility: This FPGA offers a versatile architecture that supports a wide range of applications. It provides a combination of programmable logic, digital signal processing (DSP), and embedded processing capabilities, making it suitable for diverse use cases.
  • Flexible Connectivity: With a rich set of high-speed transceivers, the XCZU17EG-3FFVB1517E enables seamless connectivity with various external devices and interfaces. It supports industry-standard protocols, such as PCIe, Ethernet, and USB, facilitating easy integration into existing systems.
  • High Memory Capacity: This FPGA features a large on-chip memory, allowing for efficient storage and retrieval of data. It also supports external memory interfaces to accommodate additional storage requirements.
  • Advanced Power Management: The XCZU17EG-3FFVB1517E incorporates advanced power management techniques, optimizing power consumption while maintaining high performance. This contributes to energy-efficient operation and reduced overall system costs.

Technical Specifications:

  • FPGA Family: XCZU17EG
  • Device Grade: -3
  • Packages: FFVB1517E
  • Logic Cells: Up to 1,143,000
  • DSP Slices: Up to 4,272
  • Internal Memory: Up to 82.8 Mb
  • Transceivers: Up to 32.75 Gbps
  • Operating Voltage: 0.95V
  • Operating Temperature: -40°C to 100°C
  • Package Type: Flip-Chip Fine-Pitch BGA (FFVB)

Application:

The XCZU17EG-3FFVB1517E FPGA finds applications in various fields, including but not limited to:

  • Wireless Communications: With its high-performance processing capabilities and flexible connectivity options, this FPGA is suitable for wireless communication systems, enabling efficient signal processing, modulation, and demodulation.
  • Image and Video Processing: The XCZU17EG-3FFVB1517E is well-suited for image and video processing applications, offering the processing power and memory capacity required for tasks such as image recognition, video encoding, and decoding.
  • High-Performance Computing: This FPGA can be leveraged in high-performance computing environments, delivering accelerated processing for applications like data

    As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU17EG-3FFVB1517E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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