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Xilinx XCZU19EG-3FFVB1517E

   
Manufacturer Part Number : XCZU19EG-3FFVB1517E
Manufacturer : Xilinx
Description : IC FPGA 644 I/O 1517FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU19EG-3FFVB1517E.PDF XCZU19EG-3FFVB1517E PDF
EDA / CAD Models : XCZU19EG-3FFVB1517E by SnapEDA
Stock Condition :In Stock, New Original
Quantity:
1 81 7340472 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU19EG-3FFVB1517E 7340472
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1517-BBGA, FCBGA
Supplier Device Package:1517-FCBGA (40x40)

Overview of XCZU19EG-3FFVB1517E

The XCZU19EG-3FFVB1517E is a state-of-the-art Field Programmable Gate Array (FPGA) brought to you by Xilinx Inc. This advanced chip combines processing systems with programmable logic, empowering users to customize their computing solutions. Its high functionality and flexibility make it an ideal choice for a wide range of technology applications, from telecommunications to aerospace and defense.

Key Features of XCZU19EG-3FFVB1517-3E

  • The XCZU19EG-3FFVB1517E has an embedded ARMR dual-core Cortex?-A9 MPCore?.
  • It incorporates high-speed connectivity interfaces, including PCI Express, Serial RapidIO, and Ethernet.
  • The chip provides substantial capacity with over 1.5 million system logic cells and 1143k logic elements.
  • It boasts high speed and low power with a maximum frequency of 500 MHz and 1V power supply.
  • The XCZU19EG-3FFVB1517E also features enhanced security with advanced encryption standard capabilities.

Technical Specifications of XCZU19EG-3FFVB1517E

The XCZU19EG-3FFVB1517E chip exhibits excellent technical prowess in its specifications. It operates at a frequency of 500MHz and has a 1V power supply, ensuring energy-efficient operation. In terms of physicality, it comes in a FB Package with a case operating temperature ranging from 0°C to 100°C. Furthermore, it has a total memory of 9M and supports lead-free soldering.

Applications of XCZU19EG-3FFVB1517E

The robust features and technical specifications of the XCZU19EG-3FFVB1517E make it suitable for various applications. It is a perfect choice for digital signal processing and embedded applications. With its high-density and low-power architecture, it is also suitable for use in high-speed networking, flat panel displays, and secure communications. Additionally, its high capacity and speed make it an exceptional option for aerospace and defense, automotive, and industrial applications.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-3FFVB1517E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU19EG-3FFVB1517E

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1517-BBGA, FCBGA
Supplier Device Package:1517-FCBGA (40x40)

Product Details

Overview of XCZU19EG-3FFVB1517E

The XCZU19EG-3FFVB1517E is a state-of-the-art Field Programmable Gate Array (FPGA) brought to you by Xilinx Inc. This advanced chip combines processing systems with programmable logic, empowering users to customize their computing solutions. Its high functionality and flexibility make it an ideal choice for a wide range of technology applications, from telecommunications to aerospace and defense.

Key Features of XCZU19EG-3FFVB1517-3E

  • The XCZU19EG-3FFVB1517E has an embedded ARMR dual-core Cortex?-A9 MPCore?.
  • It incorporates high-speed connectivity interfaces, including PCI Express, Serial RapidIO, and Ethernet.
  • The chip provides substantial capacity with over 1.5 million system logic cells and 1143k logic elements.
  • It boasts high speed and low power with a maximum frequency of 500 MHz and 1V power supply.
  • The XCZU19EG-3FFVB1517E also features enhanced security with advanced encryption standard capabilities.

Technical Specifications of XCZU19EG-3FFVB1517E

The XCZU19EG-3FFVB1517E chip exhibits excellent technical prowess in its specifications. It operates at a frequency of 500MHz and has a 1V power supply, ensuring energy-efficient operation. In terms of physicality, it comes in a FB Package with a case operating temperature ranging from 0°C to 100°C. Furthermore, it has a total memory of 9M and supports lead-free soldering.

Applications of XCZU19EG-3FFVB1517E

The robust features and technical specifications of the XCZU19EG-3FFVB1517E make it suitable for various applications. It is a perfect choice for digital signal processing and embedded applications. With its high-density and low-power architecture, it is also suitable for use in high-speed networking, flat panel displays, and secure communications. Additionally, its high capacity and speed make it an exceptional option for aerospace and defense, automotive, and industrial applications.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-3FFVB1517E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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