XCZU7EV-3FBVB900E Overview
The XCZU7EV-3FBVB900E is a powerful system on a chip (SoC) developed by Xilinx Inc. It belongs to the Xilinx Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) family, offering advanced capabilities for a wide range of applications. This particular model, the XCZU7EV-3FBVB900E, is designed to deliver exceptional performance and flexibility, making it an ideal choice for demanding embedded systems and applications that require high processing power.
Key Features
- Processing Power: The XCZU7EV-3FBVB900E is equipped with a dual-core Arm Cortex-A53 processor and a quad-core Arm Cortex-R5 processor, providing a balanced combination of high-performance processing and real-time control capabilities.
- FPGA Fabric: With an integrated FPGA fabric, this SoC offers reconfigurable logic resources that enable users to implement custom hardware accelerators and tailor the device to their specific needs.
- High-Speed Interfaces: The XCZU7EV-3FBVB900E supports a wide range of high-speed interfaces, including PCIe Gen2 and Gen3, USB 3.0, Gigabit Ethernet, and DDR4 memory interfaces, allowing for seamless connectivity and data transfer.
- High-Speed SerDes: It features numerous high-speed serial transceivers, supporting data rates of up to 16.3 Gbps per lane, enabling efficient communication with external devices and systems.
- Advanced Processing Unit (APU): The APU combines the processing power of the Arm Cortex-A53 cores with dedicated memory management units, providing high-performance execution of complex software applications.
- Real-Time Processing Unit (RPU): The RPU, consisting of the Arm Cortex-R5 cores, offers deterministic real-time processing capabilities, making it well-suited for time-critical applications.
- Security Features: This SoC includes robust security features, such as secure boot, cryptographic accelerators, and trusted execution environments, ensuring data integrity and system protection.
Technical Specifications
- FPGA Resources: The XCZU7EV-3FBVB900E provides 504K logic cells, 1,728 DSP slices, and 8.9Mb UltraRAM, enabling the implementation of complex digital designs.
- Memory: It includes 4GB of DDR4 SDRAM, offering ample space for data storage and processing.
- Operating Frequency: The SoC operates at a maximum frequency of 1.2 GHz, delivering high-speed performance.
- Package: It comes in a 900-ball flip-chip BGA package, providing compact form factor for easy integration into various systems.
- Operating Temperature: The XCZU7EV-3FBVB900E is designed to operate reliably in a temperature range of -40°C to +100°C, ensuring suitability for diverse environments.
Application
The XCZU7EV-3FBVB900E is widely used in a variety of applications that demand high processing capabilities and system flexibility. Some of the key application areas include:
- Embedded Systems
- Industrial Automation
- High-Performance
As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU7EV-3FBVB900E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.