What is Dual Inline Package?
A Dual Inline Package (DIP) is a type of integrated circuit package. It is characterized by a rectangular housing and two parallel rows of electrical connecting pins. Typically, a DIP is a plastic or ceramic housing that contains a microchip, with the dual lines of pins used to connect to a socket, soldered to a printed circuit board, or used in wire wrap projects.
DIP packages are well-suited for breadboarding, because the pins are spaced at standard intervals. This package format is less common in new designs due to the trend of miniaturization in electronics; however, DIPs are still found in many through-hole electronics.
Type of Dual-Inline Packages (DIPs)
Plastic DIP(PDIP), Shrink DIP(SDIP) and Windowed DIP(CWDIP) Package
Dual Inline Packages (DIPs) come in various types, often distiguished by the material used for the casing and the mounting method. Here are a few common types:
Plastic DIP (PDIP): This is the most common type of DIP, with a plastic casing. These are generally used in lower-cost electronics where heat dissipation is not a major concern.
Ceramic DIP (CDIP): These have a ceramic casing and are used in more demanding applications where better heat dissipation is required. They are usually more expensive than PDIPs.
Shrink DIP (SDIP): SDIPs have a smaller (shrunken) pin spacing compared to a standard DIP. This allows for more pins to be placed in a given area.
Windowed DIP (CWDIP): These have a small, transparent window on the top of the IC which allows ultraviolet light to erase programmable read-only memory (EPROM) chips.
Skinny DIP: Skinny DIPs have a narrower body than standard DIPs but retain the same pin spacing. This allows for higher-density packaging on a PCB.
Solder-Bump DIP: In this variant, small solder-bumps are placed onto the leads to provide more standoff from the PCB surface when soldered, allowing for better solder-flow under the component during assembly.
These types of DIP packages cover a range of applications, from hobbyist electronics to commercial and industrial devices. However, as integrated circuit technology evolves, these traditional DIP packages are being replaced with more compact and efficient packaging types like SOIC, QFP, and BGA.
Common Dual Inline Package IC
Dual Inline Package 7402 IC Picture
The Dual In-line Package (DIP) has been extensively used for ICs. Here are some common Dual In-line Package ICs:
Logic Gates: These produce an output based on logical manipulation of inputs. Some common DIP logic gates include the 7400 series of NAND gates, the 7402 series of NOR gates, and the 7408 series of AND gates.
Operational Amplifiers (Op Amps): Op Amps like those in the LM358 or LM741 series are designed to accept differential inputs and produce a single-ended output, and are commonly used in designs requiring amplification.
Microcontrollers: DIP packaging is commonly used for microcontrollers. For instance, both the ATmega328P and PIC16F630 are offered in DIP packages.
Memory Chips: Many types of memory can come in DIP packages, including EEPROM like the AT28C16, and some types of RAM and flash.
Timer ICs: The 555 timer is a popular DIP-packaged chip used in various timing applications.
Shift registers: These are used in applications where data needs to be stored or moved. A common DIP shift register is the 74HC595.
Advantages and Disadvantages of Dual Inline Package
Dual Inline Packages (DIPs) offer several advantages and disadvantages based on their construction and uses.
Advantages
Ease of Installation: DIPs can be easily inserted and removed from a socket on a circuit board due to their dual inline pins.
Compatibility with Breadboards: DIPs are often used in prototyping applications because their pin spacing is compatible with standard breadboard and perfboard pitch.
Thermal Management: The DIP construction allows for decent power dissipation, and many DIP chips can be used without additional heatsinks.
Durability: The hard plastic or ceramic shell of a DIP provides robustness and durability.
Disadvantages
Size and Space: Compared to newer, surface-mount technology (SMT) types of packaging, DIPs take up a lot of space on a circuit board. In today's miniaturized electronics, this can be a major disadvantage.
Limited Pin Count: DIPs usually have a lower pin count compared to other, more modern package types.
Speed Limitations: Electrical signals take longer to travel the length of the long leads in DIP packages, potentially limiting the speed of the circuit.
Soldering Difficulties: If not properly done, the dense array of pins can make soldering without bridges a bit difficult for novice users.
Not Suitable for High-Frequency Applications: For very high-frequency or sensitive analog applications, the longer lead lengths and inductances of DIP packages can lead to electrical performance degradation.
Why Dual Inline Packages (DIPs) are Being Replaced
Dual Inline Packages (DIPs) are being replaced primarily due to the increasing demand for smaller, more compact electronic devices and the advancements in surface-mount technology (SMT). SMT packages, such as Small Outline Integrated Circuits (SOICs) and Quad Flat Packages (QFPs), offer several advantages over DIPs, including smaller footprints, lower profiles, and better thermal performance. Additionally, SMT packages are well-suited for automated assembly processes, which are essential for high-volume, cost-effective electronics manufacturing.
As a result, many manufacturers have shifted away from using DIP packages in favor of SMT alternatives, which allow for denser circuit board layouts, improved performance, and reduced manufacturing costs. However, DIPs are still used in certain applications, such as prototyping, education, and in devices where through-hole mounting is preferred for its reliability and ease of use.
Compare DIP and STM Packages
Here's a comparison of Dual Inline Packages (DIPs) and Surface-Mount Technology (SMT):
DIP vs STM PackageFeature
| Dual Inline Packages (DIPs) | Surface-Mount Technology (SMT) |
|---|
| Size | Larger | Smaller |
| Profile | Higher | Lower |
| Lower | Through-hole | Surface |
| Handling | Easier to handle and solder manually | Requires specialized equipment for handling |
| Pin Count | Limited (typically up to 64) | Higher pin count possible |
| Cost | Higher cost per package | Lower cost per package |
| Automated Assembly | Not well-suited | Well-suited |
| Thermal Performance | Reduced compared to SMT | Improved due to direct contact with PCB |
| Common Applications | Prototyping, education, and through-hole mounting | Dominant technology in modern electronics manufacturing |
In summary, SMT packages offer several advantages over DIPs, such as smaller size, lower profile, higher pin count, lower cost, and better suitability for automated assembly processes. These advantages have led to the widespread adoption of SMT in modern electronics manufacturing, while DIPs are now primarily used in specific applications like prototyping, education, and through-hole mounting.
Application
While Dual Inline Packages (DIPs) are being increasingly replaced by more modern technologies, they still find use in a variety of applications:
Prototyping and Development: DIPs are widely used in breadboards and prototyping boards for development and testing due to their size and easy-to-handle nature. They can be inserted and removed without specialized equipment, making them ideal for low-volume prototyping and development.
Education: Because of the ease with which they can be manually inserted into breadboards or soldered to perfboards, DIPs are often used in educational settings, such as electronics classes and workshops.
Retro and Hobbyist Electronics: Hobbyists working on retro computing equipment or making replicas often use DIP devices. For instance, they may be used in creating replicas of early microcomputers.
Industrial Electronics: Some industrial and legacy systems still use DIPs due to durability requirements or the need for maintenance and field repairs.
Programmable Devices: DIP-style packages are still commonly used for small microcontrollers, memory, and other programmable devices. They can easily be removed and replaced if the programming needs to be updated.
Relays and Optocouplers: DIP packages are commonly used for optocouplers (devices used to isolate different sections of an electrical circuit to prevent spikes in voltage) and reed relays (used for switching).