JCET

JCET Group stands as a global power player in the domain of integrated circuit (IC) back-end manufacturing and technology services. The company offers a full suite of turnkey solutions, from semiconductor package integration design, wafer probing, bumping, assembly, to final testing and global drop shipments. This all-encompassing approach allows JCET to deliver complete, high-quality, and efficient solutions tailored to specific client needs.

The company is adept in utilizing advanced technologies such as wafer-level packaging, 2.5D/3D packaging, and System-in-Package (SiP) solutions, combined with reliable flip chip and wire bonding methods. This extensive palette of technologies enables JCET to cater to a broad variety of applications, reaching into industries such as automotive, artificial intelligence (AI), high-performance computing (HPC), storage, communication, smart devices, industrial and medical sectors, and power and energy.

JCET group's commitment to innovation and growth is further exhibited by its state-of-the-art research and development (R&D) centers located in China and Korea. Fulfilling the production aspect, the company maintains a robust network of manufacturing facilities sprawled across China, Korea, and Singapore. This combination of strong R&D capabilities and vertical integration in manufacturing ensures JCET's position as a global leader in the fast-paced and highly specialized semiconductor industry.