RF360

RF360, a subsidiary of Qualcomm, plays a crucial role in advancing RF front-end technology, particularly through its specialization in MEMS (Micro-Electro-Mechanical Systems) devices for RF applications. The company focuses on developing and marketing MEMS filters that utilize advanced acoustic technologies, including Surface Acoustic Waves (SAW), Temperature Compensated Surface Acoustic Waves (TC-SAW), and Bulk Acoustic Waves (BAW). These technologies are critical for enhancing the performance and efficiency of RF front-end modules, which are integral components in a wide range of electronic devices.

On February 3, 2017, RF360 Holdings Singapore Limited, a joint venture between Qualcomm and TDK Corporation, was established to bolster Qualcomm's RF Front End (RFFE) business unit. This strategic partnership was aimed at supporting the development and supply of RF front-end modules and RF filters. The collaboration combines Qualcomm's expertise in wireless technologies with TDK's extensive experience in electronic components, providing a robust platform for innovation and delivery of high-performance RF solutions.

The joint venture is specifically designed to address the growing demands in various sectors, including mobile terminals and emerging markets like the Internet of Things (IoT), automotive applications, and connected computing. By integrating Qualcomm's and TDK's capabilities, RF360 is well-equipped to offer comprehensive solutions that meet the complex and evolving requirements of these industries. This initiative not only strengthens Qualcomm's position in the RF market but also enhances its ability to deliver fully integrated systems that are critical for the next generation of wireless communication and electronic devices.