Coronus DX: The World's First Wafer Edge Deposition Solution

Lam Research, a leading semiconductor equipment manufacturer, has recently introduced Coronus DX, the world's first crystal edge deposition solution. This innovative solution aims to address critical process challenges in next-generation logic chips, 3D NAND, and advanced packaging applications.

With semiconductor processes continually shrinking, chip manufacturing has become increasingly challenging. Coronus DX offers a unique protective film deposition at the wafer edge, reducing defects and damage commonly encountered in advanced semiconductor manufacturing processes and improving chip yield.

Sesha Varadarajan, Vice President at Lam Research, highlights the benefits of Coronus DX in achieving predictable manufacturing and significantly enhancing yield. This technology can be applied in the production of advanced chips, semiconductor packaging, and 3D NAND memory chips, while also reducing the cost of advanced process chips.

Lam Research's Coronus series is the industry's first crystal edge technology that has undergone extensive production validation. Both Coronus and Coronus HP aim to reduce defects by removing edge layers and have been adopted in the manufacturing of 3D chips. Important customers of Lam Research include TSMC, Intel, Samsung, and other major semiconductor companies.

Coronus DX enables precise wafer alignment and process control, including integrated metrology, ensuring process consistency and repeatability. The Coronus products gradually increase wafer yield, providing an additional yield improvement of 0.2% to 0.5% per etch or deposition step, resulting in an overall wafer throughput improvement of up to 5%. Manufacturers running over 100,000 wafers per month could produce millions of additional chips worth millions of dollars using Coronus within a year.

Source: Lam Research Corporation