FAQ

• What is SiP?
• SIP, or System-in-Package, is a method of integrating multiple electronic components and functions into a single, compact package. This approach allows multiple integrated circuits (ICs) and other components, such as memory, sensors, and passive components, to be combined into a single module. This results in a smaller, more efficient, and potentially more reliable system compared to traditional methods, such as System-on-Chip (SoC) or multi-chip modules.

• Who Invented SiP?
• SiP (System in Package) technology was not invented by a single person or a company. It is a packaging technology that has evolved gradually, with multiple research institutes, companies, and engineers contributing to its development. Therefore, the invention of SiP technology cannot be attributed to a specific individual or company. However, it can be said that the development and popularization of SiP technology is closely related to the needs of the consumer electronics market and various technological advancements.