Hybrid Integrated Circuits: Concepts, Properties and Applications

Concept

A hybrid integrated circuit is an integrated circuit that combines semiconductor integration technology with thin film (thick film) technology. Hybrid integrated circuits use thin film or thick film components and their interconnection lines on the substrate, then mix and assemble discrete semiconductor chips, monolithic integrated circuits or micro components on the same substrate, and finally perform additional packaging. Compared with discrete component circuits, hybrid integrated circuits have the characteristics of high assembly density, good reliability and excellent electrical performance. Compared with monolithic integrated circuits, it is flexible in design, convenient in process, suitable for multi-variety and small-batch production, and has a wide range of component parameters, high precision, good stability, and can withstand higher voltage and power.

Features

A major feature of hybrid integrated circuits is that all their functional parts are concentrated on one substrate, which can basically eliminate auxiliary parts in electronic components and assembly gaps and solder joints between components, thereby improving the assembly density and reliability of electronic equipment. . Based on this structural property, a hybrid integrated circuit can be used as a distributed parameter network with electrical properties that are difficult to achieve with discrete component networks. Another feature is to obtain passive networks with different properties by changing the order, thickness, area, shape and properties of the three films of conductors, semiconductors and dielectrics, as well as their extraction positions.

Applications of Hybrid Integrated Circuits

The application of hybrid integrated circuits is mainly aimed at analog circuits and microwave circuits, but it is also suitable for special circuits with higher voltage and current. Includes data conversion circuits in portable radios, airborne radios, electronic computers and microprocessors, and digital-to-analog and analog-to-digital converters. The application in the microwave field is particularly prominent. The development trend of hybrid integrated circuits is to achieve secondary integration, making complex multi-functional, high-density large-scale hybrid integrated circuits possible. In addition, the passive network will develop towards a denser, more precise, and more stable direction, and integrate sensitive components in the passive network to manufacture integrated sensors.

Manufacturing process

The manufacturing process of hybrid integrated circuits is generally divided into the following steps:

1. Substrate preparation:

In order to facilitate automatic production and compact assembly in electronic equipment, hybrid integrated circuits are manufactured using standardized insulating substrates. Commonly used substrates are rectangular glass and ceramic substrates, and one or several functional circuits can be fabricated on a single substrate.

2. Film production process:

The production process is mainly to create film-like passive components and interconnection lines on the substrate to form a passive network, and then install semiconductor devices or semiconductor integrated circuit chips. The film-like passive network is fabricated by photolithography and film-forming methods. Conductor, semiconductor and dielectric films of various shapes and widths are produced on the substrate in a certain process sequence.

3. Component assembly and interconnection:

These film layers are combined with each other to form various electronic components and interconnection lines. After the entire circuit is fabricated on the substrate, lead-outs are soldered and, if required, a protective layer is applied.

4. Encapsulation:

Finally, it is encapsulated with an encapsulation shell to form a hybrid integrated circuit. This step also has an important impact on the performance of the circuit, because improper packaging may have a negative impact on the performance of the circuit.

Application development

The application of hybrid integrated circuits is very extensive, mainly in the following areas:

1. Analog circuits and microwave circuits:

The main application scenarios of hybrid integrated circuits are analog circuits and microwave circuits. Because hybrid integrated circuits can concentrate all functional parts of a circuit on a single substrate, they have unparalleled advantages in these fields.

2. Special circuits:

Hybrid integrated circuits can also be used in special circuits that need to withstand higher voltages and higher currents. This is mainly due to the design flexibility and process convenience of hybrid integrated circuits.

3. Portable radios and aeronautical radios:

Hybrid integrated circuits are widely used in portable radios and aeronautical radios. These devices require high density, high reliability and good electrical performance, which are the characteristics of hybrid integrated circuits.

4. Data conversion circuits:

In electronic computers and microprocessors, hybrid integrated circuits are often used in data conversion circuits, such as digital-to-analog and analog-to-digital converters.

5. Microwave field:

The application of hybrid integrated circuits in the microwave field is very prominent, such as in radar, communication and navigation systems. In these systems, hybrid integrated circuits can provide high-efficiency and high-performance solutions.

Development Trend

The development trend of hybrid integrated circuits is mainly reflected in the following aspects:

1. Secondary integration:

Using multi-layer wiring and adhesive tape welding technology, a single semiconductor integrated circuit is assembled and interconnected to achieve secondary integration, making complex, multi-functional, high-density Large-Scale Hybrid Integrated Circuits.

2. Further miniaturization of the passive network:

The passive network will develop towards a denser, finer, and more stable direction, and even integrate sensing elements to produce integrated sensors.

3. High-performance hybrid integrated circuits:

In order to meet the needs of specific fields, hybrid integrated circuits that can withstand high power, high voltage, and high temperature will be developed.

4. Improvement of thin-film process technology:

Improve the thin-film process technology to enable the manufacturing process of thin-film active devices to further improve the performance of hybrid integrated circuits.

5. Assembly of miniature leadless components and devices:

Assembling with substrates with interconnecting wires can reduce the price and improve the performance of electronic equipment.

6. Application of 5G and Internet of Things:

The development of 5G and Internet of Things will provide wider application scenarios for hybrid integrated circuits, such as in communication equipment, autonomous driving, intelligent manufacturing and other fields.

7. Application of AI and quantum computing:

The rapid development of artificial intelligence and quantum computing requires higher performance computing and processing capabilities, and hybrid integrated circuits are expected to play a key role in it.

Conclusion

Generally speaking, hybrid integrated circuit is an important technology in electronic engineering. It has unique advantages in design flexibility, superior electrical performance, and adaptability to high voltage and high power conditions. In the future, with the continuous advancement and development of technology, we can expect hybrid integrated circuits to play a greater role in a wider range of applications.

FAQ

What is the advantage of hybrid integrated circuit?

Hybrid integrated circuits (HICs) offer design flexibility, allowing for the integration of different technologies in a single package. They provide high performance, especially in high frequency and high power applications. Their improved reliability and ease of modification make them ideal for demanding environments. While their unit cost may be higher, they're cost-effective for low volume production. HICs also support a wide range of component parameters with high precision and stability, making them versatile for various applications.

What is the difference between hybrid circuit and integrated circuit?

Integrated Circuits (ICs) are made by etching components onto a single chip, while Hybrid Circuits combine different IC chips onto one substrate, offering design flexibility and high power handling. ICs are smaller and cheaper for high volume production, while Hybrid Circuits can offer improved performance for certain applications. The choice depends on the specific application requirements.

What is the difference between hybrid and monolithic IC?

Monolithic ICs are single-chip devices, with all components integrated onto one silicon chip. Hybrid ICs, however, combine several chips onto a single package. While monolithic ICs are compact and cost-effective, hybrid ICs offer greater flexibility in design, can handle higher power and voltage, but are larger and more costly. The choice between them depends on the specific application requirements.

What is meant by hybrid integrated circuit?

A hybrid integrated circuit (HIC) is a miniaturized electronic circuit combining individual devices like transistors, diodes, resistors, and capacitors on a substrate. It bridges the gap between monolithic integrated circuits and discrete circuits, leveraging the benefits of both for use in complex systems.