The H330S-Q30-00, manufactured by Fibocom, is a high-performance wireless module offering 3G connectivity. It supports UMTS/HSDPA/HSUPA protocols as per 3GPP release 7 with WCDMA bands 1, 2, 5, 8 or band 1, 8. For GSM connectivity, there are options for quad-band GSM/GPRS/EDGE at 850/900/1800/1900MHz or dual-band at 900/1800MHz, responding to global coverage requirements. The module can provide download speeds of up to 21 Mbps on HSDPA and upload speeds of up to 5.76 Mbps on HSUPA.
The module comes in an LGA package with 120 pins and dimensions of 33.8x27.8x2.45mm. It operates at voltage levels from DC 3.3V to 4.2V, typically at 3.8V. Operating temperatures range from -30 to +75°C, and storage temperature from -40 to +85°C, enabling versatile deployment in various environments. Data connection capabilities provided by the Fibocom H330S include embedded TCP/UDP/IP protocol stacks, aiding integration in a plethora of systems.
As a professional Fibocom distributor, Nantian Electronics has a large number of H330S-Q30-00 in stock. We also provide H330S-Q30-00 parameters, H330S-Q30-00 Datasheet PDF and pin diagram instructions for download.
Applications
What are the operating temperature ranges for the H330S-Q30-00?
The H330S-Q30-00 operates between -30 and +75°C.
What kind of connectivity does the H330S-Q30-00 offer?
The H330S-Q30-00 offers 3G connectivity with support for UMTS/HSDPA/HSUPA and GSM/GPRS/EDGE.