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Samsung Semiconductor K4EBE304ED-EGCG

Manufacturer Part Number : K4EBE304ED-EGCG
Manufacturer : Samsung Semiconductor
Description :
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : K4EBE304ED-EGCG.PDF K4EBE304ED-EGCG PDF
Download Datasheet : K4EBE304ED-EGCG Details.PDF K4EBE304ED-EGCG PDF
EDA / CAD Models : K4EBE304ED-EGCG by SnapEDA
Quantity:
1 156 5584323 samsung-semiconductor/k4ebe304ed-egcg 5584323
TYPEDESCRIPTION
Density32 Gb
Org.x32
Speed2133 Mbps
Voltage1.8 / 1.2 / 1.2 V
Temp.-25 ~ 85 °C
Package178FBGA


The K4EBE304ED-EGCG is part of Samsung's Low Power Double Data Rate 3 (LPDDR3) mobile DRAM series. Recognized for its high performance, speed, and power efficiency, it supports a wide range of mobile solutions including smartphones, IoT devices and wearables.

K4EBE304ED-EGCG Spot stock picture

K4EBE304ED-EGCG Spot stock picture

Key Features:

  1. High Performance and Speed: With speeds up to 2133 Mbps, this memory chip can handle demanding applications with ease.

  2. Power Efficiency: Operating voltages at 1.8V / 1.2V / 1.2V contribute to significant energy savings.

  3. Broad Compatibility: Its versatility makes it suitable for diverse mobile solutions from smartphones to IoT devices and wearables.

Technical Specifications:

  • Density : 32Gb (Gigabit)

  • Organization : x32

  • Speed : Up to 2133Mbps

  • Voltage : Operates at multiple voltage levels - Primary: 1.8 V; Secondary/IO: both at 1.2 V

  • Temperature Range : -25 ~ +85 °C

  • Package Type: FBGA package with total pin count as per specification

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Technical Parameters of K4EBE304ED-EGCG

TYPEDESCRIPTION
Density32 Gb
Org.x32
Speed2133 Mbps
Voltage1.8 / 1.2 / 1.2 V
Temp.-25 ~ 85 °C
Package178FBGA


Product Details

The K4EBE304ED-EGCG is part of Samsung's Low Power Double Data Rate 3 (LPDDR3) mobile DRAM series. Recognized for its high performance, speed, and power efficiency, it supports a wide range of mobile solutions including smartphones, IoT devices and wearables.

K4EBE304ED-EGCG Spot stock picture

K4EBE304ED-EGCG Spot stock picture

Key Features:

  1. High Performance and Speed: With speeds up to 2133 Mbps, this memory chip can handle demanding applications with ease.

  2. Power Efficiency: Operating voltages at 1.8V / 1.2V / 1.2V contribute to significant energy savings.

  3. Broad Compatibility: Its versatility makes it suitable for diverse mobile solutions from smartphones to IoT devices and wearables.

Technical Specifications:

  • Density : 32Gb (Gigabit)

  • Organization : x32

  • Speed : Up to 2133Mbps

  • Voltage : Operates at multiple voltage levels - Primary: 1.8 V; Secondary/IO: both at 1.2 V

  • Temperature Range : -25 ~ +85 °C

  • Package Type: FBGA package with total pin count as per specification

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