The Samsung Semiconductor's K5W2G1GACC-DL60 is a high-performance component encapsulated in a Ball Grid Array (BGA) package. The BGA packaging of this device underscores its reliability for demanding applications. The BGA package brings the advantages of superior heat dissipation, substantial electrical performance, and speedy signal transmission, thereby making it a preferred choice for a variety of high-speed and high-performance applications.
As an esteemed Samsung Semiconductor distributor, Nantian Electronics manages a comprehensive stock of K5W2G1GACC-DL60 units, ensuring reliable availability for a wide range of technological needs. Furthermore, to facilitate an in-depth understanding and application of this component, Nantian Electronics provides the K5W2G1GACC-DL60 datasheets, and pin diagram instructions for download, demonstrating their commitment to superior customer service in the realm of electronics distribution.
Samsung Semiconductor K5W2G1GACC-DL60 Package Original Label