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Xilinx XC2S200E-6FTG256C

Manufacturer Part Number : XC2S200E-6FTG256C
Manufacturer : Xilinx
Description : FPGA 1.8 V 275 MHz 182 I/O
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XC2S200E-6FTG256C.PDF XC2S200E-6FTG256C PDF
EDA / CAD Models : XC2S200E-6FTG256C by SnapEDA
Quantity:
473 474 7049837 /datasheets//XC2S200E-6FTG256C-2768793.pdf Xilinx-Inc/XC2S200E-6FTG256C 7049837
Product AttributeAttribute Value
Manufacturer:Xilinx(AMD)
Product Category:FPGA - Field Programmable Gate Array
Number of Logic Elements:5292 LE
Adaptive Logic Modules - ALMs:2352 ALM
Embedded Memory:56 kbit
Number of I/Os:182 I/O
Supply Voltage - Min:1.8 V
Supply Voltage - Max:1.8 V
Minimum Operating Temperature:0 C
Maximum Operating Temperature:+ 85 C
Mounting Style:SMD/SMT
Package / Case:FBGA-256
Brand:AMD / Xilinx
Distributed RAM:75264 bit
Embedded Block RAM - EBR:56 kbit
Maximum Operating Frequency:275 MHz
Moisture Sensitive:Yes
Number of Logic Array Blocks - LABs:1176 LAB
Operating Supply Voltage:1.8 V

The XC2S200E-6FTG256C, manufactured by Xilinx (now part of AMD), is a field-programmable gate array (FPGA) that offers a blend of versatility and performance suitable for a wide range of applications. This FPGA features 5292 logic elements and 2352 adaptive logic modules, providing substantial flexibility and capacity for hardware programming. It includes 56 kbit of embedded memory and supports a maximum of 182 I/O ports, allowing for extensive interfacing with other components. Operating strictly at a supply voltage of 1.8 V, it ensures energy efficiency while maintaining a performance peak with a maximum operating frequency of 275 MHz. The device is designed to operate within a temperature range from 0°C to 85°C and is packaged in an FBGA-256 format, making it ideal for surface mount technology.

XC2S200E-6FTG256C Chip

XC2S200E-6FTG256C Chip

As a professional Xilinx distributor, Nantian Electronics has a large number of XC2S200E-6FTG256C in stock. We also provide XC2S200E-6FTG256C parameters, XC2S200E-6FTG256C Datasheet PDF and pin diagram instructions for download.

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Technical Parameters of XC2S200E-6FTG256C

Product AttributeAttribute Value
Manufacturer:Xilinx(AMD)
Product Category:FPGA - Field Programmable Gate Array
Number of Logic Elements:5292 LE
Adaptive Logic Modules - ALMs:2352 ALM
Embedded Memory:56 kbit
Number of I/Os:182 I/O
Supply Voltage - Min:1.8 V
Supply Voltage - Max:1.8 V
Minimum Operating Temperature:0 C
Maximum Operating Temperature:+ 85 C
Mounting Style:SMD/SMT
Package / Case:FBGA-256
Brand:AMD / Xilinx
Distributed RAM:75264 bit
Embedded Block RAM - EBR:56 kbit
Maximum Operating Frequency:275 MHz
Moisture Sensitive:Yes
Number of Logic Array Blocks - LABs:1176 LAB
Operating Supply Voltage:1.8 V

Product Details

The XC2S200E-6FTG256C, manufactured by Xilinx (now part of AMD), is a field-programmable gate array (FPGA) that offers a blend of versatility and performance suitable for a wide range of applications. This FPGA features 5292 logic elements and 2352 adaptive logic modules, providing substantial flexibility and capacity for hardware programming. It includes 56 kbit of embedded memory and supports a maximum of 182 I/O ports, allowing for extensive interfacing with other components. Operating strictly at a supply voltage of 1.8 V, it ensures energy efficiency while maintaining a performance peak with a maximum operating frequency of 275 MHz. The device is designed to operate within a temperature range from 0°C to 85°C and is packaged in an FBGA-256 format, making it ideal for surface mount technology.

XC2S200E-6FTG256C Chip

XC2S200E-6FTG256C Chip

As a professional Xilinx distributor, Nantian Electronics has a large number of XC2S200E-6FTG256C in stock. We also provide XC2S200E-6FTG256C parameters, XC2S200E-6FTG256C Datasheet PDF and pin diagram instructions for download.

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