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7340449
https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf
Xilinx-Inc/XCZU11EG-3FFVF1517E
7340449
| Architecture: | MCU, FPGA |
| Core Processor: | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
| MCU RAM: | 256KB |
| Peripherals: | DMA, WDT |
| Connectivity: | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed: | 600MHz, 1.5GHz |
| Primary Attributes: | Zynq?UltraScale+? FPGA, 653K+ Logic Cells |
| Operating Temperature: | 0～C ~ 100～C (TJ) |
| Package / Case: | 1517-BBGA, FCBGA |
| Supplier Device Package: | 1517-FCBGA (40x40) |
Overview of the XCZU11EG-3FFVF1517E
The XCZU11EG-3FFVF1517E is an exceptional product from the renowned manufacturer, Xilinx Inc. Known for its high performance and versatility, it falls under the category of integrated circuits that are specifically designed for embedded applications. It is a highly integrated and flexible System-on-Chip (SoC), built with top-of-the-line technology, and it delivers a potent combination of ARM Cortex-A53 application processing unit, ARM real-time processing unit, and Xilinx programmable logic.
Key Features
Designed with cutting-edge technology, the XCZU11EG-3FFVF1517E boasts several key features that allow it to be a top contender in its field. These include an ARM dual-core Cortex-A53 MPCore, an ARM dual-core Cortex-R5 MPCore, UltraScale architecture and programmable logic. Yet another feature that sets it apart is the in-built security system, which helps protect the integrated circuits from any potential threats and ensures a smooth operation.
- ARM dual-core Cortex-A53 MPCore
- ARM dual-core Cortex-R5 MPCore
- UltraScale architecture
- In-built security system
Technical Specifications
The XCZU11EG-3FFVF1517E comes with quite an impressive list of technical specifications. It has a maximum operating temperature of 100 degrees Celsius and a minimum of 0 degrees Celsius. It operates at a supply voltage of 0.95V to 1.08V. The product also has a Surface Mount Technology (SMT) mounting style. It features a 1517-pin flip-chip Ball Grid Array (BGA).
- Operating Temperature: 0-100 degrees Celsius
- Supply Voltage: 0.95V-1.08V
- Mounting style: Surface Mount Technology (SMT)
- 1517-pin flip-chip Ball Grid Array (BGA)
Application
The XCZU11EG-3FFVF1517E from Xilinx Inc. is a versatile tool with a wide range of applications. It is commonly used in industries such as telecommunications, defense, and aerospace for various purposes such as board prototyping, creating servers, and developing mobile applications. It is also used in embedded vision, Industrial Internet of Things (IIoT), and 5G wireless applications to name a few. Its cutting-edge technology and specifications make it an ideal solution for the most stringent technological needs and challenges.
As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU11EG-3FFVF1517E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.