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https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf
Xilinx-Inc/XCZU17EG-2FFVD1760E
7340456
Architecture: | MCU, FPGA |
Core Processor: | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? |
MCU RAM: | 256KB |
Peripherals: | DMA, WDT |
Connectivity: | CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: | 600MHz, 1.5GHz |
Primary Attributes: | Zynq?UltraScale+? FPGA, 926K+ Logic Cells |
Operating Temperature: | 0~C ~ 100~C (TJ) |
Package / Case: | 1760-BBGA, FCBGA |
Supplier Device Package: | 1760-FCBGA (42.5x42.5) |
Overview of XCZU17EG-2FFVD1760E from Xilinx Inc.
The XCZU17EG-2FFVD1760E is a revolutionary piece of technology developed by the leading semiconductor manufacturer, Xilinx Inc. Constituting a part of the Zynq-7000 family, this chip utilizes a dual-core ARM Cortex-A53 platform which integrates both FPGA and CPU capabilities. It is designed specifically to advance the functionalities in a wide range of applications including connectivity, video imaging, AI, system security, and industrial automation.
Key Features
This highly integrable chip comes with a plethora of key features that makes it an essential component in various systems. These include: high-level system integration, advanced memory and interface technologies, ARM-based processing system, improved power management, and enhanced security features.
- High-Level System Integration: Offers an all programmable system that enables the design of highly flexible, integrated systems.
- Advanced memory and interface technologies: Supports DDR4, DDR3, DDR3L, LPDDR3 interfaces along with other interfacing options.
- ARM-Based Processing System: Features a dual-core ARM Cortex-A53 processing system which promotes high-compute performance.
- Improved Power Management: Optimized power usage and efficient thermal management to ensure system longevity and reliability.
- Enhanced Security Features: Implements secure boot, Crypto engines, and running AES for improved system security.
Technical Specifications
XCZU17EG-2FFVD1760E from Xilinx Inc. guarantees top-level performance backed by its impressive technical specifications.
- Processor Core: Dual-Core ARM Cortex-A53
- Memory: DDR4, DDR3, DDR3L, LPDDR3
- Operating Temperature: 0°C ~ 100°C
- Package / Case: 1760-BBGA, FCBGA
- Supply Voltage: 0.95V
Application
The XCZU17EG-2FFVD1760E is extensively used in an array of applications that include but are not limited to IoT (Internet of Things), Industrial Automation, Medical Appliances, Machine Learning, Robotics, and Automotive. Its dual-core ARM processor and FPGA integration allow for the creation of customized, high-performance, power-efficient systems, making it the perfect choice for these diversified application fields.
As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU17EG-2FFVD1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.