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Xilinx XCZU17EG-L1FFVD1760I

Manufacturer Part Number : XCZU17EG-L1FFVD1760I
Manufacturer : Xilinx
Description : IC FPGA 308 I/O 1760FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU17EG-L1FFVD1760I.PDF XCZU17EG-L1FFVD1760I PDF
EDA / CAD Models : XCZU17EG-L1FFVD1760I by SnapEDA
Quantity:
1 81 7340455 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU17EG-L1FFVD1760I 7340455
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

XCZU17EG-L1FFVD1760I - Overview

The XCZU17EG-L1FFVD1760I is an advanced FPGA device engineered by Xilinx Inc., a leading player in high-performance programmable logic devices. This innovative product integrates a powerful application processing system (APU) and a real-time processing unit (RPU) within an ARMR dual-core CortexR-A53 Application Processing Unit (APU), along with an ARM Mali?-400 MP2 Graphics Processing Unit (GPU). It is designed to provide heightened computation power, high-speed connectivity, high system integration, and enhanced security features.

Key Features

  • Features an ARMR dual-core CortexR-A53 Application Processing Unit (APU).
  • Incorporates an ARM Mali?-400 MP2 Graphics Processing Unit (GPU).
  • Lockstep capable ARMR dual-core CortexR-R5 Real Time Processing Unit (RPU).
  • Equipped with programmable logic equivalent to a ZynqR UltraScale+? MPSoC.
  • Offers powerful on-chip system memory (OCM) with ECC.

Technical Specifications

The XCZU17EG-L1FFVD1760I is engineered with the UltraScale architecture by Xilinx, which provides increased system performance and flexibility. It's a Low-Range product of the EG family and comes in a FFVD1760 package with a ?1 speed grade. The device operates with an industrial temperature range of -40°C to 100°C. Memory specifications include 4 GB of on-chip ECC memory for superior reliability. This model also offers PCI Express compliance (Gen2x4 and Gen3x4) and features an extensive range of high-speed interfaces.

Applications

The versatile design of the XCZU17EG-L1FFVD1760I makes it suitable for a wide range of applications. Given its high-speed performance and efficient energy profile, it can be used in data center applications, embedded vision, the internet of things (IoT), and 5G wireless solutions. Its advanced security features also make this device an excellent choice for applications requiring encryption and secure data traffic.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU17EG-L1FFVD1760I. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU17EG-L1FFVD1760I

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Product Details

XCZU17EG-L1FFVD1760I - Overview

The XCZU17EG-L1FFVD1760I is an advanced FPGA device engineered by Xilinx Inc., a leading player in high-performance programmable logic devices. This innovative product integrates a powerful application processing system (APU) and a real-time processing unit (RPU) within an ARMR dual-core CortexR-A53 Application Processing Unit (APU), along with an ARM Mali?-400 MP2 Graphics Processing Unit (GPU). It is designed to provide heightened computation power, high-speed connectivity, high system integration, and enhanced security features.

Key Features

  • Features an ARMR dual-core CortexR-A53 Application Processing Unit (APU).
  • Incorporates an ARM Mali?-400 MP2 Graphics Processing Unit (GPU).
  • Lockstep capable ARMR dual-core CortexR-R5 Real Time Processing Unit (RPU).
  • Equipped with programmable logic equivalent to a ZynqR UltraScale+? MPSoC.
  • Offers powerful on-chip system memory (OCM) with ECC.

Technical Specifications

The XCZU17EG-L1FFVD1760I is engineered with the UltraScale architecture by Xilinx, which provides increased system performance and flexibility. It's a Low-Range product of the EG family and comes in a FFVD1760 package with a ?1 speed grade. The device operates with an industrial temperature range of -40°C to 100°C. Memory specifications include 4 GB of on-chip ECC memory for superior reliability. This model also offers PCI Express compliance (Gen2x4 and Gen3x4) and features an extensive range of high-speed interfaces.

Applications

The versatile design of the XCZU17EG-L1FFVD1760I makes it suitable for a wide range of applications. Given its high-speed performance and efficient energy profile, it can be used in data center applications, embedded vision, the internet of things (IoT), and 5G wireless solutions. Its advanced security features also make this device an excellent choice for applications requiring encryption and secure data traffic.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU17EG-L1FFVD1760I. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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