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Xilinx XCZU19EG-2FFVD1760I

Manufacturer Part Number : XCZU19EG-2FFVD1760I
Manufacturer : Xilinx
Description : IC FPGA 308 I/O 1760FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU19EG-2FFVD1760I.PDF XCZU19EG-2FFVD1760I PDF
EDA / CAD Models : XCZU19EG-2FFVD1760I by SnapEDA
Quantity:
1 81 7340475 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU19EG-2FFVD1760I 7340475
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

XCZU19EG-2FFVD1760I Overview

The XCZU19EG-2FFVD1760I is a high-performance product manufactured by Xilinx Inc. This device is a part of the Zynq UltraScale+ series, recognized for their powerful processing capabilities and flexible design options. The XCZU19EG-2FFVD1760I is specifically designed to meet the demanding needs of advanced embedded systems with its abundant processing power, versatility, and speed.

Key Features

Some of the distinguishing features of the XCZU19EG-2FFVD1760I include:

  • Embedded ARM CPU
  • High-speed transceiver technology
  • Advanced packaging technology
  • In-built programmable logic

These features enable developers to create highly customized and differentiated system designs.

Technical Specifications

The XCZU19EG-2FFVD1760I comes with a wide range of technical specifications to cater to different user needs and applications. These include:

  • Flip-chip 1760-pin package
  • 16nm technology node
  • High performance, multi-core 64-bit CPU
  • Up to 8GB DDR4 or 4GB DDR3 system memory

These specifications empower the device to deliver the performance and flexibility required for today's complex system designs.

Application

The versatility of the XCZU19EG-2FFVD1760I lends itself to a multitude of applications. It is ideal for:

  • Advanced embedded systems
  • Communication infrastructure
  • Data center applications
  • Aerospace and defense

Overall, the XCZU19EG-2FFVD1760I is an exceptional product from Xilinx Inc., designed to harness the power and flexibility needed for advanced system designs across various industry sectors.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-2FFVD1760I. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

Request for Quotation

Technical Parameters of XCZU19EG-2FFVD1760I

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Product Details

XCZU19EG-2FFVD1760I Overview

The XCZU19EG-2FFVD1760I is a high-performance product manufactured by Xilinx Inc. This device is a part of the Zynq UltraScale+ series, recognized for their powerful processing capabilities and flexible design options. The XCZU19EG-2FFVD1760I is specifically designed to meet the demanding needs of advanced embedded systems with its abundant processing power, versatility, and speed.

Key Features

Some of the distinguishing features of the XCZU19EG-2FFVD1760I include:

  • Embedded ARM CPU
  • High-speed transceiver technology
  • Advanced packaging technology
  • In-built programmable logic

These features enable developers to create highly customized and differentiated system designs.

Technical Specifications

The XCZU19EG-2FFVD1760I comes with a wide range of technical specifications to cater to different user needs and applications. These include:

  • Flip-chip 1760-pin package
  • 16nm technology node
  • High performance, multi-core 64-bit CPU
  • Up to 8GB DDR4 or 4GB DDR3 system memory

These specifications empower the device to deliver the performance and flexibility required for today's complex system designs.

Application

The versatility of the XCZU19EG-2FFVD1760I lends itself to a multitude of applications. It is ideal for:

  • Advanced embedded systems
  • Communication infrastructure
  • Data center applications
  • Aerospace and defense

Overall, the XCZU19EG-2FFVD1760I is an exceptional product from Xilinx Inc., designed to harness the power and flexibility needed for advanced system designs across various industry sectors.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-2FFVD1760I. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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