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Xilinx XCZU19EG-3FFVC1760E

Manufacturer Part Number : XCZU19EG-3FFVC1760E
Manufacturer : Xilinx
Description : IC FPGA 512 I/O 1760FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU19EG-3FFVC1760E.PDF XCZU19EG-3FFVC1760E PDF
EDA / CAD Models : XCZU19EG-3FFVC1760E by SnapEDA
Quantity:
1 81 7340477 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU19EG-3FFVC1760E 7340477
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Overview of the XCZU19EG-3FFVC1760E by Xilinx Inc.

The XCZU19EG-3FFVC1760E is a high-performance and high-capacity Field Programmable Gate Array (FPGA) product from the industry-leading manufacturer, Xilinx Inc. This powerful component is part of the ZynqR UltraScale+? MPSoCs family, known for delivering versatility and optimized performance for a wide range of applications.

Key Features

  • Designed with 747K logic cells that provide the capability to process complex operations.
  • Extensive memory capacity, including a 78.6 Mb block RAM and 270 Mb UltraRAM.
  • Dual-core ARM Cortex-R5 real-time processors for effective task prioritization and system performance.
  • Performs up to 1,968.00 DSP slices.
  • Inclusion of a Quad-core ARM Cortex-A53 application processing unit.

Technical Specifications

The XCZU19EG-3FFVC1760E is built with a state-of-the-art technology process, offering reliable and efficient functioning. This FPGA product stands out with its 16nm process size. It operates efficiently within a temperature range of 0°C ~ 100°C (TJ) and is designed to handle a surface mount package case. Furthermore, it is equipped with an FCBGA-1760 supplier device package.

Applications

Given the FPGA's remarkable capacity and design, the XCZU19EG-3FFVC1760E from Xilinx Inc. is suitable for a multitude of applications. These include but are not limited to data center applications, network functions, accelerations, machine learning, image processing, and various embedded vision systems. It can also be effectively used in the development of wired and 5G wireless infrastructure and defense-grade applications.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-3FFVC1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU19EG-3FFVC1760E

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Product Details

Overview of the XCZU19EG-3FFVC1760E by Xilinx Inc.

The XCZU19EG-3FFVC1760E is a high-performance and high-capacity Field Programmable Gate Array (FPGA) product from the industry-leading manufacturer, Xilinx Inc. This powerful component is part of the ZynqR UltraScale+? MPSoCs family, known for delivering versatility and optimized performance for a wide range of applications.

Key Features

  • Designed with 747K logic cells that provide the capability to process complex operations.
  • Extensive memory capacity, including a 78.6 Mb block RAM and 270 Mb UltraRAM.
  • Dual-core ARM Cortex-R5 real-time processors for effective task prioritization and system performance.
  • Performs up to 1,968.00 DSP slices.
  • Inclusion of a Quad-core ARM Cortex-A53 application processing unit.

Technical Specifications

The XCZU19EG-3FFVC1760E is built with a state-of-the-art technology process, offering reliable and efficient functioning. This FPGA product stands out with its 16nm process size. It operates efficiently within a temperature range of 0°C ~ 100°C (TJ) and is designed to handle a surface mount package case. Furthermore, it is equipped with an FCBGA-1760 supplier device package.

Applications

Given the FPGA's remarkable capacity and design, the XCZU19EG-3FFVC1760E from Xilinx Inc. is suitable for a multitude of applications. These include but are not limited to data center applications, network functions, accelerations, machine learning, image processing, and various embedded vision systems. It can also be effectively used in the development of wired and 5G wireless infrastructure and defense-grade applications.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-3FFVC1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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