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Xilinx XCZU19EG-L2FFVD1760E

Manufacturer Part Number : XCZU19EG-L2FFVD1760E
Manufacturer : Xilinx
Description : IC FPGA 308 I/O 1760FCBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XCZU19EG-L2FFVD1760E.PDF XCZU19EG-L2FFVD1760E PDF
EDA / CAD Models : XCZU19EG-L2FFVD1760E by SnapEDA
Quantity:
1 81 7340476 https://www.xilinx.com/support/documentation/data_sheets/ds925-zynq-ultrascale-plus.pdf Xilinx-Inc/XCZU19EG-L2FFVD1760E 7340476
Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Overview of XCZU19EG-L2FFVD1760E

Xilinx Inc. presents the XCZU19EG-L2FFVD1760E, a state-of-the-art integrated circuit. This advanced chip belongs to a family of UltraScale+ MPSoCs, combining high-performance capabilities with enhanced power efficiency. It's a sophisticated piece of hardware that includes multiple processing units, advanced interface protocols, and a high-speed DRAM memory interface, all within a compact 1760-pin package.

Key Features of XCZU19EG-L2FFVD1760E

  • High-performance processing units: It consists of multiple processing units, each adept at handling complex tasks with ease.
  • Advanced interface protocols: The chip supports modern interface protocols, facilitating seamless interaction with a vast range of devices.
  • High-speed DRAM memory interface: The chip boasts a high-speed DRAM memory interface, ensuring quick data access and optimal performance.
  • Compact 1760-pin package: Even with its advanced capabilities, the XCZU19EG-L2FFVD1760E is compact, making it easy to integrate into different systems.

Technical Specifications of XCZU19EG-L2FFVD1760E

This chip is a stellar example of Xilinx Inc's technical prowess. It boasts a high processing speed, facilitated by multiple Arm Cortex processing cores. The XCZU19EG-L2FFVD1760E operates at a core supply voltage of 0.72V to 0.9V, and it’s designed to operate within a temperature range of 0°C to 85°C. The chip is RoHS compliant, ensuring that it meets the highest environmental standards.

Applications of XCZU19EG-L2FFVD1760E

The XCZU19EG-L2FFVD1760E chip from Xilinx Inc. finds application in a broad array of sectors. From telecommunications and automotive industries to healthcare and defense, this chip can cater to complex performance needs. It's particularly well-suited for high-performance applications, such as image processing, artificial intelligence, and cloud computing.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-L2FFVD1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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Technical Parameters of XCZU19EG-L2FFVD1760E

Architecture:MCU, FPGA
Core Processor:Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
MCU RAM:256KB
Peripherals:DMA, WDT
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:600MHz, 1.5GHz
Primary Attributes:Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature:0~C ~ 100~C (TJ)
Package / Case:1760-BBGA, FCBGA
Supplier Device Package:1760-FCBGA (42.5x42.5)

Product Details

Overview of XCZU19EG-L2FFVD1760E

Xilinx Inc. presents the XCZU19EG-L2FFVD1760E, a state-of-the-art integrated circuit. This advanced chip belongs to a family of UltraScale+ MPSoCs, combining high-performance capabilities with enhanced power efficiency. It's a sophisticated piece of hardware that includes multiple processing units, advanced interface protocols, and a high-speed DRAM memory interface, all within a compact 1760-pin package.

Key Features of XCZU19EG-L2FFVD1760E

  • High-performance processing units: It consists of multiple processing units, each adept at handling complex tasks with ease.
  • Advanced interface protocols: The chip supports modern interface protocols, facilitating seamless interaction with a vast range of devices.
  • High-speed DRAM memory interface: The chip boasts a high-speed DRAM memory interface, ensuring quick data access and optimal performance.
  • Compact 1760-pin package: Even with its advanced capabilities, the XCZU19EG-L2FFVD1760E is compact, making it easy to integrate into different systems.

Technical Specifications of XCZU19EG-L2FFVD1760E

This chip is a stellar example of Xilinx Inc's technical prowess. It boasts a high processing speed, facilitated by multiple Arm Cortex processing cores. The XCZU19EG-L2FFVD1760E operates at a core supply voltage of 0.72V to 0.9V, and it’s designed to operate within a temperature range of 0°C to 85°C. The chip is RoHS compliant, ensuring that it meets the highest environmental standards.

Applications of XCZU19EG-L2FFVD1760E

The XCZU19EG-L2FFVD1760E chip from Xilinx Inc. finds application in a broad array of sectors. From telecommunications and automotive industries to healthcare and defense, this chip can cater to complex performance needs. It's particularly well-suited for high-performance applications, such as image processing, artificial intelligence, and cloud computing.

As a reputable distributor of Xilinx, Nantian Electronics is committed to providing our customers with brand-new, original Xilinx XCZU19EG-L2FFVD1760E. We offer these products at competitive prices and include a one-year warranty for your peace of mind. Furthermore, we don't require a minimum order quantity and guarantee same-day delivery service to meet your immediate needs.

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