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Xilinx XC7Z045-1FFG900I

Manufacturer Part Number : XC7Z045-1FFG900I
Manufacturer : Xilinx
Description : IC SOC CORTEX-A9 KINTEX7 900FBGA
Lead Free Status / RoHS Status : Lead free / RoHS Compliant
Datasheet : XC7Z045-1FFG900I.PDF XC7Z045-1FFG900I PDF
EDA / CAD Models : XC7Z045-1FFG900I by SnapEDA
Quantity:
1 81 7340218 http://www.xilinx.com/support/documentation/data_sheets/ds190-Zynq-7000-Overview.pdf Xilinx-Inc/XC7Z045-1FFG900I 7340218
Architecture:MCU, FPGA
Core Processor:Dual ARM? Cortex?-A9 MPCore? with CoreSight?
MCU RAM:256KB
Peripherals:DMA
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:667MHz
Primary Attributes:Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)

Manufactured by Xilinx (acquired by AMD), the XC7Z045-1FFG900I is an advanced System-on-Chip (SoC) FPGA that combines high performance with a wide range of features. This device integrates dual cores and operates at a maximum clock frequency of 667 MHz, making it highly capable in processing and executing complex tasks efficiently. It boasts a substantial number of logic elements, approximately 350,000, along with 54,650 adaptive logic modules, providing a robust platform for hardware customization and application-specific designs. The FPGA includes 19.2 Mbit of embedded memory and offers 362 I/O ports, facilitating extensive connectivity and interface options. Designed to perform in a wide range of temperatures from -40°C to +100°C, and housed in an FBGA-900 package, this SoC FPGA is ideal for demanding environments where reliability and adaptability are crucial.

XC7Z045-1FFG900I

XC7Z045-1FFG900I

As a professional Xilinx(AMD) distributor, Nantian Electronics has a large number of XC7Z045-1FFG900I in stock. We also provide XC7Z045-1FFG900I parameters, XC7Z045-1FFG900I Datasheet PDF and pin diagram instructions for download.

Original XC7Z045-1FFG900I Label

Application

The features of the XC7Z045-1FFG900I make it particularly suitable for telecommunications, automotive and industrial automation applications that require high-speed data processing and system integration.

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Technical Parameters of XC7Z045-1FFG900I

Architecture:MCU, FPGA
Core Processor:Dual ARM? Cortex?-A9 MPCore? with CoreSight?
MCU RAM:256KB
Peripherals:DMA
Connectivity:CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:667MHz
Primary Attributes:Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature:-40~C ~ 100~C (TJ)
Package / Case:900-BBGA, FCBGA
Supplier Device Package:900-FCBGA (31x31)

Product Details

Manufactured by Xilinx (acquired by AMD), the XC7Z045-1FFG900I is an advanced System-on-Chip (SoC) FPGA that combines high performance with a wide range of features. This device integrates dual cores and operates at a maximum clock frequency of 667 MHz, making it highly capable in processing and executing complex tasks efficiently. It boasts a substantial number of logic elements, approximately 350,000, along with 54,650 adaptive logic modules, providing a robust platform for hardware customization and application-specific designs. The FPGA includes 19.2 Mbit of embedded memory and offers 362 I/O ports, facilitating extensive connectivity and interface options. Designed to perform in a wide range of temperatures from -40°C to +100°C, and housed in an FBGA-900 package, this SoC FPGA is ideal for demanding environments where reliability and adaptability are crucial.

XC7Z045-1FFG900I

XC7Z045-1FFG900I

As a professional Xilinx(AMD) distributor, Nantian Electronics has a large number of XC7Z045-1FFG900I in stock. We also provide XC7Z045-1FFG900I parameters, XC7Z045-1FFG900I Datasheet PDF and pin diagram instructions for download.

Original XC7Z045-1FFG900I Label

Application

The features of the XC7Z045-1FFG900I make it particularly suitable for telecommunications, automotive and industrial automation applications that require high-speed data processing and system integration.

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